Young Suh Song from Seoul National University Receives Excellent Presentation Award at IEEE Conference
Seoul, Korea – Young Suh Song, a researcher from the Department of Electrical and Computer Engineering at Seoul National University was awarded the Excellent Presentation Award at the “5th International Conference on Circuits, Systems and Simulation,” organized by the Institute of Electrical and Electronics Engineers (IEEE). IEEE organization is renowned for its extensive membership, boasting over 460,000 members in approximately 190 countries, with more than 66 percent residing outside the United States [IEEE Website].
The award-winning research paper, “Thermal-Aware IC Chip Design by Combining High Thermal Conductivity Materials and GAA MOSFET,” focused on crucial thermal management improvement in semiconductor technology. Since the modern IC chip has incorporated the high integration over and over again, thermal-aware IC chip design has become a top priority in the semiconductor field these days. In this regard, this research has proposed a novel groundbreaking transistor design with electrical/thermal co-optimization.
The awarded research emphasized the utilization of aluminum oxide (Al2O3) due to its compatibility with CMOS fabrication and superior thermal conductivity, compared to other materials. The combination of Al2O3 and gate-all-around (GAA) MOSFET in the proposed methodology has led to significant thermal improvements, reducing the maximum lattice temperature in transistors to a large extent. This research also showed that the proposed approach could simultaneously achieve electrical and thermal improvement, which could provide significant pivotal advancement in the modern semiconductor technology.
Applying this technology could offer substantial improvements in managing the thermal characteristics of billions of transistors within IC chips, potentially extending the lifespan and enhancing the performance of semiconductor devices. This improvement is crucial in reducing the frequency of transistor failure at high temperatures, thus enhancing the performance and durability of IC chips, at the same time.
For more details, the full research is available on the IEEE
Website: https://ieeexplore.ieee.org/document/9802341.
Media Contact
Company Name: Seoul National University
Contact Person: Young Suh Song
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Country: South Korea
Website: https://www.ieee.org
